Invention Grant
- Patent Title: Resistance semiconductor memory device having three-dimensional stack and word line decoding method thereof
- Patent Title (中): 具有三维堆叠和字线解码方法的电阻半导体存储器件
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Application No.: US12873836Application Date: 2010-09-01
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Publication No.: US07907467B2Publication Date: 2011-03-15
- Inventor: Joon-Min Park , Sang-Beom Kang , Hyung-Rok Oh , Woo-Yeong Cho
- Applicant: Joon-Min Park , Sang-Beom Kang , Hyung-Rok Oh , Woo-Yeong Cho
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2007-0007697 20070125
- Main IPC: G11C8/00
- IPC: G11C8/00

Abstract:
A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved.
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