Invention Grant
- Patent Title: Electrocasting method
- Patent Title (中): 电铸法
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Application No.: US12057903Application Date: 2008-03-28
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Publication No.: US07908098B2Publication Date: 2011-03-15
- Inventor: Kazumasa Seki , Akihiko Hatamura , Hitoshi Yoshida , Toshio Yamashita
- Applicant: Kazumasa Seki , Akihiko Hatamura , Hitoshi Yoshida , Toshio Yamashita
- Applicant Address: JP Kyoto
- Assignee: OMRON Corporation
- Current Assignee: OMRON Corporation
- Current Assignee Address: JP Kyoto
- Agency: Osha • Liang LLP
- Priority: JP2007-088396 20070329
- Main IPC: G01F17/00
- IPC: G01F17/00

Abstract:
The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity.
Public/Granted literature
- US20080237050A1 ELECTROCASTING METHOD Public/Granted day:2008-10-02
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