Invention Grant
- Patent Title: LED packaged structure and applications of LED as light source
- Patent Title (中): LED封装结构和应用LED作为光源
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Application No.: US11984730Application Date: 2007-11-21
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Publication No.: US07915605B2Publication Date: 2011-03-29
- Inventor: Tzong-Liang Tsai , Chih-Ching Cheng
- Applicant: Tzong-Liang Tsai , Chih-Ching Cheng
- Applicant Address: TW Taichung
- Assignee: HUGA Optotech Inc.
- Current Assignee: HUGA Optotech Inc.
- Current Assignee Address: TW Taichung
- Agency: Jianq Chyun IP Office
- Priority: TW96131342A 20070824
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
LED packaged structures and applications thereof are disclosed, characterized in that: an active layer in the LED or the LED packaged structure is formed on a first semiconductor conductive layer with multi-quantum wells; and a second semiconductor conductive layer is formed on the active layer; wherein a plurality of particles formed by at least one hetero-material are scattered between the first semiconductor conductive layer and the active layer in order to form an uneven multi-quantum well.
Public/Granted literature
- US20080283820A1 LED packaged structure and applications of LED as light source Public/Granted day:2008-11-20
Information query
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