Invention Grant
- Patent Title: Nitride semiconductor material, semiconductor element, and manufacturing method thereof
- Patent Title (中): 氮化物半导体材料,半导体元件及其制造方法
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Application No.: US11738655Application Date: 2007-04-23
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Publication No.: US07915646B2Publication Date: 2011-03-29
- Inventor: Toshiyuki Takizawa , Tetsuzo Ueda
- Applicant: Toshiyuki Takizawa , Tetsuzo Ueda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2006-144701 20060524
- Main IPC: H01L29/778
- IPC: H01L29/778

Abstract:
The nitride semiconductor material according to the present invention includes a group III nitride semiconductor and a group IV nitride formed on the group III nitride semiconductor, where an interface between the group III nitride semiconductor and the group IV nitride has a regular atomic arrangement. Moreover, an arrangement of nitrogen atoms of the group IV nitride in the interface and an arrangement of group III atoms of the group III nitride semiconductor in the interface may be substantially identical.
Public/Granted literature
- US20080121896A1 Nitride semiconductor material, semiconductor element, and Manufacturing method thereof Public/Granted day:2008-05-29
Information query
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