Invention Grant
- Patent Title: Semiconductor die package including IC driver and bridge
- Patent Title (中): 半导体管芯封装，包括IC驱动器和桥
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Application No.: US12046734Application Date: 2008-03-12
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Publication No.: US07915721B2Publication Date: 2011-03-29
- Inventor: Yong Liu , Jiangyuan Zhang , Qiuxiao Qian
- Applicant: Yong Liu , Jiangyuan Zhang , Qiuxiao Qian
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A semiconductor die package. Embodiments of the semiconductor die package are usable in backlight circuitry. Systems in packages may include a bridge circuit or a part thereof, and a integrated circuit die, such as a driver die, encapsulated by a molding material or other package. The bridge circuit may be stacked on opposing surfaces of a leadframe.
Public/Granted literature
- US20090230518A1 SEMICONDUCTOR DIE PACKAGE INCLUDING IC DRIVER AND BRIDGE Public/Granted day:2009-09-17
Information query
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