Invention Grant
- Patent Title: Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
- Patent Title (中): 电子装置包装板，包装板制造方法，半导体模块，半导体模块制造方法和移动装置
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Application No.: US11957030Application Date: 2007-12-14
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Publication No.: US07915737B2Publication Date: 2011-03-29
- Inventor: Mayumi Nakasato , Yoshio Okayama , Ryosuke Usui
- Applicant: Mayumi Nakasato , Yoshio Okayama , Ryosuke Usui
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2006-337708 20061215; JP2006-343036 20061220; JP2007-314240 20071205; JP2007-314241 20071205
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A manufacturing technology is provided capable of improving the reliability of a semiconductor module having a via contact connected to an electrode part of a semiconductor component. The semiconductor module includes: a semiconductor component provided with an electrode part on a mounting surface; an insulating layer provided on the mounting surface of the semiconductor component; a wiring layer formed on the insulating layer; a first conductor part which is embedded in the insulating layer and which is in contact with the electrode part; and a second conductor part which is formed in an aperture provided in the insulating layer above the first conductor part and which electrically connects the first conductor part and the wiring layer.
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