Invention Grant
US07916271B2 Apparatus and method for specifying correlation, exposure apparatus, and device manufacturing method
失效
用于指定相关性的装置和方法,曝光装置和装置制造方法
- Patent Title: Apparatus and method for specifying correlation, exposure apparatus, and device manufacturing method
- Patent Title (中): 用于指定相关性的装置和方法,曝光装置和装置制造方法
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Application No.: US11489360Application Date: 2006-07-19
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Publication No.: US07916271B2Publication Date: 2011-03-29
- Inventor: Hideki Ina , Satoru Oishi
- Applicant: Hideki Ina , Satoru Oishi
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Cowan, Liebowitz & Latman, P.C.
- Priority: JP2005-210320 20050720
- Main IPC: G03B27/42
- IPC: G03B27/42

Abstract:
Disclosed is a method and apparatus which are arranged to detect magnitude of correlation between (i) an explanatory variable corresponding to operation data related to an operation made by an exposure apparatus for exposing a substrate, and (ii) a response variable corresponding to inspection data related to a result of inspection made to the substrate after the same is exposed, the magnitude of correlation between the explanatory variable and the response variable being detected with respect to each of different combinations of operation data pieces, and also arranged to specify, on the basis of detected correlation magnitudes and with respect to one of the different combinations of operation data pieces, a category of the operation data and the correlation between the explanatory variable and the response variable.
Public/Granted literature
- US20070019857A1 Apparatus and method for specifying correlation, exposure apparatus, and device manufacturing method Public/Granted day:2007-01-25
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