Invention Grant
- Patent Title: Heat dissipation device
- Patent Title (中): 散热装置
-
Application No.: US12436786Application Date: 2009-05-07
-
Publication No.: US07916469B2Publication Date: 2011-03-29
- Inventor: Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
- Applicant: Shi-Wen Zhou , Jun Cao , Qing-Song Xu , Chun-Chi Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tucheng, Taipei County
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tucheng, Taipei County
- Agent Frank R. Niranjan
- Priority: CN200810305019 20081020
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20
Abstract:
A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
Public/Granted literature
- US20100097763A1 HEAT DISSIPATION DEVICE Public/Granted day:2010-04-22
Information query
