Invention Grant
- Patent Title: Loop heat pipe and electronic device
- Patent Title (中): 回路热管和电子设备
-
Application No.: US12495341Application Date: 2009-06-30
-
Publication No.: US07916482B2Publication Date: 2011-03-29
- Inventor: Kentaro Tomioka , Tomonao Takamatsu
- Applicant: Kentaro Tomioka , Tomonao Takamatsu
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2008-319942 20081216
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
According to one embodiment, a loop heat pipe including a fluid circulating channel containing fluid, includes: an evaporating portion configured to vaporize the fluid by heat from a heat generating component; a condensing portion configured to liquefy the vaporized fluid; a first fluid channel connecting the evaporating portion and the condensing portion, the vaporized fluid flowing through the first fluid channel; a second fluid channel connecting the evaporating portion and the condensing portion, the fluid liquefied by the condensing portion flowing through the second fluid channel; a liquid accumulating portion formed on an inner wall of the second fluid channel, and provided between the evaporating portion and the condensing portion, the liquid accumulating portion being configured to accumulate the liquid liquefied by the condensing portion; and a wick provided between the evaporating portion and a position where the liquid accumulating portion is formed.
Public/Granted literature
- US20100149755A1 Loop Heat Pipe and Electronic Device Public/Granted day:2010-06-17
Information query