Invention Grant
- Patent Title: Semiconductor inspection apparatus
- Patent Title (中): 半导体检测仪器
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Application No.: US11482089Application Date: 2006-07-07
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Publication No.: US07916926B2Publication Date: 2011-03-29
- Inventor: Hidemitsu Naya , Takuya Shirato , Akira Karakama
- Applicant: Hidemitsu Naya , Takuya Shirato , Akira Karakama
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2005-200668 20050708
- Main IPC: G09G5/00
- IPC: G09G5/00

Abstract:
An inspected image can be communicated without putting large load on a network. A remote console enables an operation screen and a moving image to be displayed and processed without color shifts. Information on the operation screen is not communicated as bitmap information, but event information such as a formation of a window and the moving of a mouse is communicated as information at a level of I parts of graphical user interface. Moreover, communication of the event information on the operation screen and communication of a moving image are separated. In addition, a method of compressing information on the operation screen and a method of compressing information on the moving image are separated. A necessary part of information on the moving image is selected and communicated depending on the state of the semiconductor inspection apparatus, an operation of an operator, and a pattern to be inspected.
Public/Granted literature
- US20070024643A1 Semiconductor inspection apparatus Public/Granted day:2007-02-01
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