Invention Grant
- Patent Title: Tracking thermal mini-cycle stress
- Patent Title (中): 跟踪热微循环应力
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Application No.: US12194606Application Date: 2008-08-20
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Publication No.: US07917328B2Publication Date: 2011-03-29
- Inventor: Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcom S. Ware , Roger D. Weekly
- Applicant: Jon A. Casey , Michael S. Floyd , Soraya Ghiasi , Kenneth C. Marston , Jennifer V. Muncy , Malcom S. Ware , Roger D. Weekly
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Francis Lammes; Stephen J. Walder, Jr.; Diana R. Gerhardt
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.
Public/Granted literature
- US20100049466A1 Tracking Thermal Mini-Cycle Stress Public/Granted day:2010-02-25
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