Invention Grant
US07917328B2 Tracking thermal mini-cycle stress 失效
跟踪热微循环应力

Tracking thermal mini-cycle stress
Abstract:
Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.
Public/Granted literature
Information query
Patent Agency Ranking
0/0