Invention Grant
- Patent Title: Motherboard power on circuit
- Patent Title (中): 主板上电电路
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Application No.: US12056257Application Date: 2008-03-26
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Publication No.: US07917780B2Publication Date: 2011-03-29
- Inventor: Ke-You Hu
- Applicant: Ke-You Hu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- Agent Frank R. Niranjan
- Priority: CN200810300520 20080311
- Main IPC: G06F1/26
- IPC: G06F1/26
Abstract:
A motherboard power on circuit includes a switch connector, an impedance circuit, and a super I/O chip. The impedance circuit includes a first resistor, a second resistor, and a capacitor. A terminal of the first resistor is connected to the power on terminal of the switch connector. The other terminal of the first resistor is connected to the power on terminal of the super I/O chip, a terminal of the second resistor, and a terminal of the capacitor. The other terminals of the second resistor and the capacitor are connected to a power source and ground respectively.
Public/Granted literature
- US20090231000A1 MOTHERBOARD POWER ON CIRCUIT Public/Granted day:2009-09-17
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