Invention Grant
US07918021B2 Production of via hole in a flexible printed circuit board by applying a laser or punch
失效
通过施加激光或冲孔在柔性印刷电路板中制造通孔
- Patent Title: Production of via hole in a flexible printed circuit board by applying a laser or punch
- Patent Title (中): 通过施加激光或冲孔在柔性印刷电路板中制造通孔
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Application No.: US12169850Application Date: 2008-07-09
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Publication No.: US07918021B2Publication Date: 2011-04-05
- Inventor: Ryuichiro Kogure , Tadahiro Yokozawa , Hiroaki Yamaguchi , Osamu Nakayama
- Applicant: Ryuichiro Kogure , Tadahiro Yokozawa , Hiroaki Yamaguchi , Osamu Nakayama
- Applicant Address: JP Yamaguchi
- Assignee: Ube Industries, Ltd.
- Current Assignee: Ube Industries, Ltd.
- Current Assignee Address: JP Yamaguchi
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2002-122256 20020424
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K7/20
Abstract:
A flexible circuit printable board can be favorably produced by a process composed of steps of forming in a polyimide film having a metal coat on each surface side a via hole penetrating at least one metal coat and the polyimide film; and applying a mixture of liquid and abrasive grains under pressure onto the via hole, whereby smoothing an edge of the via hole and cleaning the via hole.
Public/Granted literature
- US20090002953A1 PRODUCTION OF VIA HOLE IN FLEXIBLE CIRCUIT PRINTABLE BOARD Public/Granted day:2009-01-01
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