Invention Grant
US07918036B2 Surface shape measuring apparatus and surface shape measuring method
有权
表面形状测量装置和表面形状测量方法
- Patent Title: Surface shape measuring apparatus and surface shape measuring method
- Patent Title (中): 表面形状测量装置和表面形状测量方法
-
Application No.: US12309132Application Date: 2008-05-21
-
Publication No.: US07918036B2Publication Date: 2011-04-05
- Inventor: Yasunari Ishikawa
- Applicant: Yasunari Ishikawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee: Tokyo Seimitsu Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Christie, Parker & Hale LLP
- Priority: JP2007-172955 20070629
- International Application: PCT/JP2008/059757 WO 20080521
- International Announcement: WO2009/004872 WO 20090108
- Main IPC: G01B5/20
- IPC: G01B5/20 ; G01B5/28

Abstract:
In a surface shape measurement device that measures the surface shape of a sample (W1, W2) by moving a probe (16, 26) in a sliding fashion along the surface of the sample (W1, W2) and thereby detecting the amount of displacement of the probe (16, 26) caused by irregularities on the surface, an initial amount of displacement is detected which is the amount of displacement of the probe (16, 26) when the probe is first placed in contact with a measurement start point on the surface of the sample (W1, W2), and the amount of displacement of the probe (16, 26), detected as it is moved in a sliding fashion along the surface, is compared with the initial amount of displacement to determine whether the probe (16, 26) has reached a measurement end point.
Public/Granted literature
- US20090300930A1 SURFACE SHAPE MEASURING APPARATUS AND SURFACE SHAPE MEASURING METHOD Public/Granted day:2009-12-10
Information query