The present invention relates to a stress sensor to be combined with an assembled object of an input unit of an electronic device. The stress sensor includes a circuit substrate and a pointing operation element disposed on a surface of the circuit substrate. The circuit substrate is combined with an assembled object of an input unit by a connecting mechanism such that the circuit substrate is directly attached onto a surface of the assembled object. As a result, the overall height of the stress sensor and the assembled object is reduced in comparison with the prior art.