Invention Grant
- Patent Title: Substrate carrier and facility interface and apparatus including same
- Patent Title (中): 基板载体和设备接口及其设备
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Application No.: US12177598Application Date: 2008-07-22
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Publication No.: US07918251B2Publication Date: 2011-04-05
- Inventor: Chen-Hua Yu , Yi-Li Hsiao
- Applicant: Chen-Hua Yu , Yi-Li Hsiao
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B65B1/04
- IPC: B65B1/04
Abstract:
A carrier comprises an enclosure, a cabinet and at least one substrate holder. The enclosure comprises a door. The cabinet is coupled to the carrier. The cabinet comprises at least one valve and contains at least one reduction fluid. The substrate holder is disposed within the enclosure to support at least one substrate.
Public/Granted literature
- US20080304943A1 SUBSTRATE CARRIER AND FACILITY INTERFACE AND APPARATUS INCLUDING SAME Public/Granted day:2008-12-11
Information query
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