Invention Grant
US07918267B2 Heat dissipation device having cap for protecting thermal interface material thereon
失效
具有用于保护其上的热界面材料的帽的散热装置
- Patent Title: Heat dissipation device having cap for protecting thermal interface material thereon
- Patent Title (中): 具有用于保护其上的热界面材料的帽的散热装置
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Application No.: US11752903Application Date: 2007-05-23
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Publication No.: US07918267B2Publication Date: 2011-04-05
- Inventor: Hui Shen , Gen-Ping Deng , Yi-Qiang Wu
- Applicant: Hui Shen , Gen-Ping Deng , Yi-Qiang Wu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agent Jeffrey T. Knapp
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink.
Public/Granted literature
- US20080289797A1 HEAT DISSIPATION DEVICE HAVING CAP FOR PROTECTING THERMAL INTERFACE MATERIAL THEREON Public/Granted day:2008-11-27
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