Invention Grant
- Patent Title: Conveying device using electrostatic adsorbing plate
- Patent Title (中): 输送装置采用静电吸附板
-
Application No.: US11990167Application Date: 2006-08-11
-
Publication No.: US07918329B2Publication Date: 2011-04-05
- Inventor: Hidemasa Araie , Kenichi Takashima , Susumu Takagi
- Applicant: Hidemasa Araie , Kenichi Takashima , Susumu Takagi
- Applicant Address: JP Fukui
- Assignee: Seiren Co., Ltd
- Current Assignee: Seiren Co., Ltd
- Current Assignee Address: JP Fukui
- Agency: Dilworth & Barrese, LLP
- Priority: JP2005-234366 20050812
- International Application: PCT/JP2006/316201 WO 20060811
- International Announcement: WO2007/020988 WO 20070222
- Main IPC: B65G35/00
- IPC: B65G35/00
Abstract:
Provided is a low-cost electrostatic attraction transfer apparatus which can perform high-speed transfer, stabilizes a contact status of an electrostatic attraction board with a film and the like and does not generate fine defects on an object to be transferred.
Public/Granted literature
- US20100133070A1 Conveying Device Using Electrostatic Adsorbing Plate Public/Granted day:2010-06-03
Information query
IPC分类:
