Invention Grant
- Patent Title: Assembly machine constructed with a light-weight module
- Patent Title (中): 组装机构采用重量轻的模块
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Application No.: US12455426Application Date: 2009-06-01
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Publication No.: US07918333B1Publication Date: 2011-04-05
- Inventor: Douglas L Swanson
- Applicant: Douglas L Swanson
- Applicant Address: US PA Erie
- Assignee: Swanson Systems Inc.
- Current Assignee: Swanson Systems Inc.
- Current Assignee Address: US PA Erie
- Agent Richard K Thomson
- Main IPC: B65G21/00
- IPC: B65G21/00

Abstract:
A plurality of modules of sufficiently light weight (
Public/Granted literature
- US1774446A Device for interrupting electric currents Public/Granted day:1930-08-26
Information query
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