Invention Grant
- Patent Title: Wire bonding deflector for a wire bonder
- Patent Title (中): 导线焊接机的导线接合器
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Application No.: US12851981Application Date: 2010-08-06
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Publication No.: US07918378B1Publication Date: 2011-04-05
- Inventor: Ken Pham
- Applicant: Ken Pham
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Beyer Law Group LLP
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.
Information query
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