Invention Grant
- Patent Title: Process for attaching components with near-zero standoff to printed circuit boards
- Patent Title (中): 将印刷电路板附近零件附加零件的工艺
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Application No.: US11287841Application Date: 2005-11-28
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Publication No.: US07918381B2Publication Date: 2011-04-05
- Inventor: Michael R. Witty , David W. Ihms , Joel D. Hunt
- Applicant: Michael R. Witty , David W. Ihms , Joel D. Hunt
- Applicant Address: US MI Troy
- Assignee: Delphi Technologies, Inc.
- Current Assignee: Delphi Technologies, Inc.
- Current Assignee Address: US MI Troy
- Agent Jimmy L. Funke
- Main IPC: B23K31/00
- IPC: B23K31/00
Abstract:
The present invention relates to a method and apparatus for mounting electrical components to electric circuit boards. Specifically, the present invention relates to a method for mounting electrical components having near-zero standoff height to electrical printed circuit boards.
Public/Granted literature
- US20070119910A1 Process for attaching components with near-zero standoff to printed circuit boards Public/Granted day:2007-05-31
Information query
IPC分类:
