Methods and devices for placing a semiconductor wafer or other substrate in contact with solder are described. A wave soldering apparatus includes a solder bath, a nozzle for producing a solder wave, and a jig for orienting a substrate in a substantially vertical orientation and placing the substrate in contact with a cascading solder wave. In another wave soldering apparatus, a jig orients a semiconductor wafer in a substantially horizontal orientation in contact with the solder wave. Another soldering apparatus includes a tank comprising molten solder and a fixture configured to orient one or more semiconductor wafers in a substantially vertical orientation. Methods of placing semiconductor wafers or other substrates in contact with solder using the devices of the present invention are also disclosed.