Invention Grant
- Patent Title: Inkjet printhead integrated circuit comprising a multilayered substrate
- Patent Title (中): 喷墨打印头集成电路包括多层基板
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Application No.: US12501456Application Date: 2009-07-12
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Publication No.: US07918537B2Publication Date: 2011-04-05
- Inventor: Kia Silverbrook , Angus John North
- Applicant: Kia Silverbrook , Angus John North
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J2/04
- IPC: B41J2/04 ; B41J2/05

Abstract:
An inkjet printhead integrated circuit including a multilayered substrate having drive circuitry and a plurality of nozzle arrangements. Each nozzle arrangement includes: a floor having an ink inlet defined therein; a roof spaced apart from the floor; sidewalls extending between the roof and the floor so as to define a nozzle chamber; and a heater element suspended in the chamber and connected to the drive circuitry. When actuation energy is supplied to the heater element from the drive circuitry, a vapor bubble is formed in ink contained in the nozzle chamber resulting in ejection of ink via the ink ejection port.
Public/Granted literature
- US20090267995A1 Inkjet Printhead Integrated Circuit Comprising A Multilayered Substrate Public/Granted day:2009-10-29
Information query
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