A socket connector assembly includes a socket substrate, terminals, and conductive posts. The socket substrate has a mating side and an opposite mounting side with holes extending through the socket substrate. The terminals are disposed above the mating side of the socket substrate and are configured to engage conductive pads of a mating substrate of an electronic package. The conductive posts are disposed in the holes and are elongated between upper and lower ends. The upper ends are electrically coupled with the terminals and the lower ends are configured to be electrically joined with a circuit board. The posts electrically couple the electronic package with the circuit board by providing conductive pathways through the socket substrate between the mating side and the mounting side of the socket substrate.