A socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. When the integrated circuit is seated on the platform, the two piece connector assemblies pivot so as to make contact between a contact pad on the IC and the board for establishing or evaluating signal transmission by the IC. The platform houses a resilient tubular member that biases the connector assembly in a disengaged position out of contact with the board or test equipment. When the IC is placed on the platform, the bias of the resilient tubular member is overcome and an electrical connection is established across the connector assembly.