Invention Grant
- Patent Title: Connector assemblies and daughter card assemblies configured to engage each other along a side interface
- Patent Title (中): 连接器组件和子卡组件被配置为沿着侧面接口彼此接合
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Application No.: US12730958Application Date: 2010-03-24
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Publication No.: US07918683B1Publication Date: 2011-04-05
- Inventor: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger
- Applicant: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/64
- IPC: H01R13/64

Abstract:
A connector assembly including a connector that has a mating surface with an array of connector terminals thereon. The mating surface interfaces with a side surface of a daughter card assembly when the daughter card assembly is moved to an engaged position. The array of connector terminals are configured to engage an array of card terminals of the daughter card assembly. The connector assembly also includes a guide assembly that has a guide channel and a cam member that slidably engages the guide channel to direct the daughter card assembly to an offset position. In the offset position, the side and mating surfaces form a non-orthogonal angle with respect to each other. The guide channel is configured to permit the daughter card assembly to be rotated about an axis of rotation so that the daughter card assembly moves from the offset position to the engaged position.
Information query