Invention Grant
- Patent Title: Methods for treating wafers on assembly carriers
- Patent Title (中): 在装配载体上处理晶片的方法
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Application No.: US11852885Application Date: 2007-09-10
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Publication No.: US07918714B2Publication Date: 2011-04-05
- Inventor: Werner Kroeninger , Manfred Schneegans
- Applicant: Werner Kroeninger , Manfred Schneegans
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: DE102005011107 20050310
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B29C65/76
Abstract:
A method and a device for treating wafers on assembly carriers is disclosed. A wafer to be treated can be fixed on a liquid film that is located between the front side of the wafer and the assembly carrier by freezing of the film.
Public/Granted literature
- US20080057834A1 Method and Device for Treating Wafers on Assembly Carriers Public/Granted day:2008-03-06
Information query
