Invention Grant
- Patent Title: Method of smelting copper
- Patent Title (中): 冶炼铜的方法
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Application No.: US12502710Application Date: 2009-07-14
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Publication No.: US07918917B2Publication Date: 2011-04-05
- Inventor: Kenta Nakakado , Makoto Hamamoto , Seiichi Watanabe
- Applicant: Kenta Nakakado , Makoto Hamamoto , Seiichi Watanabe
- Applicant Address: JP Tokyo
- Assignee: Pan Pacific Copper Co., Ltd.
- Current Assignee: Pan Pacific Copper Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2008-227127 20080904
- Main IPC: C22B15/06
- IPC: C22B15/06 ; C22B15/14
Abstract:
A method of smelting copper includes: a generating step of generating blister and calcium ferrite slag from copper matte by charging the copper matte into a smelting furnace and oxidizing the copper matte; and a refining step of refining another blister from the calcium ferrite slag in an electrical furnace under a temperature condition of 1250 degrees C. to 1350 degrees C. and under a reductive atmosphere condition of oxygen partial pressure logPO2≦−9.3.
Public/Granted literature
- US20100050811A1 METHOD OF SMELTING COPPER Public/Granted day:2010-03-04
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