Invention Grant
- Patent Title: Method of producing silicon carbide epitaxial layer
- Patent Title (中): 生产碳化硅外延层的方法
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Application No.: US11990335Application Date: 2006-08-17
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Publication No.: US07918937B2Publication Date: 2011-04-05
- Inventor: Mikael Syväjärvi , Rositsa Yakimova
- Applicant: Mikael Syväjärvi , Rositsa Yakimova
- Applicant Address: JP Nagoya
- Assignee: EL-Seed Corp.
- Current Assignee: EL-Seed Corp.
- Current Assignee Address: JP Nagoya
- Agency: Harness, Dickey & Pierce, PLC
- International Application: PCT/EP2006/008130 WO 20060817
- International Announcement: WO2007/020092 WO 20070222
- Main IPC: C30B25/02
- IPC: C30B25/02

Abstract:
A method of producing an epitaxial layer on a substrate of silicon carbide is provided. Utilizing the system, silicon carbide can be grown with a thickness uniformity that is better than 5% at a growth rate which is at least 100 μm/hour. The method comprises providing a cavity with a source material and a substrate of monolithic silicon carbide, evacuating the cavity and raising the temperature to 1400° C. Then the temperature is increased at a rate of about 20° C./min until a predetermined growth temperature is reached. Thereafter, the temperature is kept such that a predetermined growth rate between 10 μm/min and 300 μm/min is obtained.
Public/Granted literature
- US20090126624A1 Method of Producing silicon carbide epitaxial layer Public/Granted day:2009-05-21
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