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US07918937B2 Method of producing silicon carbide epitaxial layer 有权
生产碳化硅外延层的方法

Method of producing silicon carbide epitaxial layer
Abstract:
A method of producing an epitaxial layer on a substrate of silicon carbide is provided. Utilizing the system, silicon carbide can be grown with a thickness uniformity that is better than 5% at a growth rate which is at least 100 μm/hour. The method comprises providing a cavity with a source material and a substrate of monolithic silicon carbide, evacuating the cavity and raising the temperature to 1400° C. Then the temperature is increased at a rate of about 20° C./min until a predetermined growth temperature is reached. Thereafter, the temperature is kept such that a predetermined growth rate between 10 μm/min and 300 μm/min is obtained.
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