Invention Grant
- Patent Title: Method of making a guide wire by using a heat mold device
- Patent Title (中): 通过使用热模具装置制造导丝的方法
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Application No.: US12230094Application Date: 2008-08-22
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Publication No.: US07918947B2Publication Date: 2011-04-05
- Inventor: Tomihisa Kato
- Applicant: Tomihisa Kato
- Applicant Address: JP Aichi-ken
- Assignee: Asahi Intecc Co., Ltd.
- Current Assignee: Asahi Intecc Co., Ltd.
- Current Assignee Address: JP Aichi-ken
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2005-166188 20050606
- Main IPC: C21D9/52
- IPC: C21D9/52

Abstract:
In a method of making a guide wire 1 by using a heat mold device 1, the metallic mold body 2 is made from the material, the thermal expansional coefficient of which is the same of a metallic coiled wire 91 to stabilize a shape-forming configuration 94. A plurality of the mold bodies 2 are arranged in a mold frame 6A to make the reverse side 22 of one mold body 2 tightly contact with the obverse side 21 of other mold body 2 among the neighboring mold bodies 2. A jig arm 7A sandwiches an array of metallic mold bodies 2 and the side plate 63 to serve as a securement member 7. Upon manufacturing the guide wire 9 for use in the medical field, the method of making the heat mold device 1 contributes to producing a high quality guide wire with a high productivity.
Public/Granted literature
- US20090000105A1 Method of making a guide wire by using a heat mold device Public/Granted day:2009-01-01
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