Invention Grant
US07918963B2 Method and apparatus for adhering parts maintaining adjusted position
失效
用于粘贴保持调节位置的零件的方法和装置
- Patent Title: Method and apparatus for adhering parts maintaining adjusted position
- Patent Title (中): 用于粘贴保持调节位置的零件的方法和装置
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Application No.: US10666235Application Date: 2003-09-19
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Publication No.: US07918963B2Publication Date: 2011-04-05
- Inventor: Taroh Terashi , Hisayoshi Ohshima , Yuusuke Taneda
- Applicant: Taroh Terashi , Hisayoshi Ohshima , Yuusuke Taneda
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2002-276294 20020920
- Main IPC: B29C65/00
- IPC: B29C65/00

Abstract:
An apparatus maintaining adjusted positions of parts assembled by adhering includes a device coating plural sections between a part and an adhering target with light energy curable adhesives adhering the part to the adhering target, a light energy irradiating device for curing the adhesive, and a detecting device detecting a displacement of the part from the adhering target. A curing shrinkage force control device is also provided to control the light energy irradiating device to change the light and thus control curing shrinkage forces to offset undesirable stresses generated by the curing shrinkage forces when undesirable displacement is detected.
Public/Granted literature
- US20040129382A1 Method and apparatus for adhering parts maintaining adjusted position Public/Granted day:2004-07-08
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