A process and a mold for molding parts. The mold is fabricated using a mixture of a viscous resin such as a gel coat containing nano particles. Electrical conductors are incorporated in the mold surface. The resulting mold in use is heatable by application of electricity to produce parts substantially reducing cure and post cure time. Completed parts containing conductive nano particles may also be produced and are heatable in use for applications where it is desirable to heat the part in use such as de-icing panels. A composition for fabricating parts containing a resin and nano particle segments in sufficient quantity to establish a conductive path is also disclosed.