Invention Grant
- Patent Title: Lidding for a child-resistant blister package
- Patent Title (中): 注意防儿童泡罩包装
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Application No.: US11784977Application Date: 2007-04-09
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Publication No.: US07919171B2Publication Date: 2011-04-05
- Inventor: Patrick Henry Young
- Applicant: Patrick Henry Young
- Applicant Address: US DE Wilmington
- Assignee: E. I. Du Pont de Nemours and Company
- Current Assignee: E. I. Du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: B32B1/00
- IPC: B32B1/00 ; B65D1/09 ; B65D83/04 ; B65D85/42
Abstract:
A blister package is provided in which the lidding component includes a tear-resistant nonwoven layer and a barrier layer wherein the controlled delamination of the nonwoven layer increases the puncture resistance, thereby improving the child-resistant properties of the package.
Public/Granted literature
- US20080245698A1 Lidding for a child-resistant blister package Public/Granted day:2008-10-09
Information query
