Invention Grant
US07919227B2 Positive resist composition and method of forming resist pattern
有权
正型抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Positive resist composition and method of forming resist pattern
- Patent Title (中): 正型抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US12440447Application Date: 2007-08-07
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Publication No.: US07919227B2Publication Date: 2011-04-05
- Inventor: Yohei Kinoshita , Takeshi Iwai , Toshiyuki Ogata
- Applicant: Yohei Kinoshita , Takeshi Iwai , Toshiyuki Ogata
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2006-246130 20060911
- International Application: PCT/JP2007/065445 WO 20070807
- International Announcement: WO2008/032512 WO 20080320
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30

Abstract:
A positive resist composition including a resin component (A) which exhibits increased alkali solubility under action of acid and an acid-generator component (B) which generates acid upon exposure, the resin component (A) including a structural unit (a1) represented by general formula (I) shown below: wherein R represents a hydrogen atom, a halogen atom, a lower alkyl group or a halogenated lower alkyl group; R1′ represents a hydrogen atom or a lower alkyl group; n represents an integer of 0 to 3; R1 represents a lower alkyl group, a fluorine atom, or a fluorinated lower alkyl group; and p represents an integer of 0 to 2.
Public/Granted literature
- US20100040970A1 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN Public/Granted day:2010-02-18
Information query
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