Invention Grant
US07919230B2 Thermal embossing of resist reflowed lenses to make aspheric lens master wafer
有权
抗压回流镜片的热压花可制成非球面透镜母晶片
- Patent Title: Thermal embossing of resist reflowed lenses to make aspheric lens master wafer
- Patent Title (中): 抗压回流镜片的热压花可制成非球面透镜母晶片
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Application No.: US12213837Application Date: 2008-06-25
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Publication No.: US07919230B2Publication Date: 2011-04-05
- Inventor: Steve Oliver , Shashikant Hegde , Jeff Viens
- Applicant: Steve Oliver , Shashikant Hegde , Jeff Viens
- Applicant Address: KY George Town
- Assignee: Aptina Imaging Corporation
- Current Assignee: Aptina Imaging Corporation
- Current Assignee Address: KY George Town
- Main IPC: G02B3/02
- IPC: G02B3/02
Abstract:
Methods of forming a lens master wafer having aspheric lens shapes. In one embodiment, a substrate is coated with a polymer material. Isolated sections are formed in the polymer material. The isolated sections are reflowed. The reflowed sections are formed into aspheric lens shapes using a lens stamp.
Public/Granted literature
- US20090325107A1 Thermal embossing of resist reflowed lenses to make aspheric lens master wafer Public/Granted day:2009-12-31
Information query
IPC分类:
| G | 物理 |
| G02 | 光学 |
| G02B | 光学元件、系统或仪器 |
| G02B3/00 | 简单或复合透镜 |
| G02B3/02 | .具有非球面的（G02B3/10优先） |
