Invention Grant
US07919343B2 Group III nitride crystal and method for surface treatment thereof, group III nitride stack and manufacturing method thereof, and group III nitride semiconductor device and manufacturing method thereof
有权
III族氮化物晶体及其表面处理方法,III族氮化物叠层及其制造方法以及III族氮化物半导体器件及其制造方法
- Patent Title: Group III nitride crystal and method for surface treatment thereof, group III nitride stack and manufacturing method thereof, and group III nitride semiconductor device and manufacturing method thereof
- Patent Title (中): III族氮化物晶体及其表面处理方法,III族氮化物叠层及其制造方法以及III族氮化物半导体器件及其制造方法
-
Application No.: US12432105Application Date: 2009-04-29
-
Publication No.: US07919343B2Publication Date: 2011-04-05
- Inventor: Keiji Ishibashi , Naoki Matsumoto , Masato Irikura
- Applicant: Keiji Ishibashi , Naoki Matsumoto , Masato Irikura
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2008-119835 20080501
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for surface treatment of a group III nitride crystal includes the steps of lapping a surface of a group III nitride crystal using a hard abrasive grain with a Mohs hardness higher than 7, and abrasive-grain-free polishing the lapped surface of the group III nitride crystal using a polishing solution without containing abrasive grain, and the polishing solution without containing abrasive grain has a pH of not less than 1 and not more than 6, or not less than 8.5 and not more than 14. Accordingly, the method for surface treatment of a group III nitride crystal can be provided according to which hard abrasive grains remaining at the lapped crystal can be removed to reduce impurities at the crystal surface.
Public/Granted literature
Information query
IPC分类: