Invention Grant
- Patent Title: Micromechanical component and manufacturing method
- Patent Title (中): 微机械部件及制造方法
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Application No.: US12090566Application Date: 2006-11-29
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Publication No.: US07919346B2Publication Date: 2011-04-05
- Inventor: Arnd Kaelberer , Jens Frey
- Applicant: Arnd Kaelberer , Jens Frey
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102005059905 20051215
- International Application: PCT/EP2006/069044 WO 20061129
- International Announcement: WO2007/068590 WO 20070621
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A micromechanical component has a substrate, a first intermediate layer which is situated thereupon, and a first layer which is situated thereupon and is structured down to the first intermediate layer. A second intermediate layer is situated above the first layer. A second layer is situated on the former, at least one movable micromechanical structure being structured into the second layer. The second intermediate layer is removed in a sacrificial zone beneath the movable micromechanical structure and the first intermediate layer is partially removed in zones beneath the first layer. The movable micromechanical structure is provided with at least one stop surface on a bottom face, this stop surface being contactable with a zone of the first layer which is supported by the first intermediate layer by deflection of the movable micromechanical structure. A method for producing such a micromechanical component is also described.
Public/Granted literature
- US20080315332A1 Micromechanical Component and Manufacturing Method Public/Granted day:2008-12-25
Information query
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