Invention Grant
- Patent Title: Multi-surface IC packaging structures and methods for their manufacture
- Patent Title (中): 多表面IC封装结构及其制造方法
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Application No.: US12778972Application Date: 2010-05-12
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Publication No.: US07919355B2Publication Date: 2011-04-05
- Inventor: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Kevin P. Grundy
- Applicant: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber, legal representative , Kevin P. Grundy
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L21/56
- IPC: H01L21/56
Abstract:
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
Public/Granted literature
- US20100221871A1 Multi-Surface IC Packaging Structures and Methods for their Manufacture Public/Granted day:2010-09-02
Information query
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