Invention Grant
US07919362B2 Method for preparing a cover for protecting a component on a substrate
有权
制备用于保护基材上的组分的覆盖物的方法
- Patent Title: Method for preparing a cover for protecting a component on a substrate
- Patent Title (中): 制备用于保护基材上的组分的覆盖物的方法
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Application No.: US12011333Application Date: 2008-01-25
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Publication No.: US07919362B2Publication Date: 2011-04-05
- Inventor: Sébastien Bolis
- Applicant: Sébastien Bolis
- Applicant Address: FR Paris
- Assignee: Commissariat A l'Energie Atomique
- Current Assignee: Commissariat A l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Nixon Peabody LLP
- Priority: FR0752907 20070126
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method for preparing a cover on a substrate in particular for the encapsulation of electronic, optical, optoelectronic components, of the electromechanical microsystems type, also known as Micro-Electro-Mechanical Systems (MEMS) or optoelectromechanical microsystems, also known as Micro-Opto-Elect-Mechanical systems (MOEMS), joined to the substrate.
Public/Granted literature
- US20080180890A1 Method for preparing a cover for protecting a component on a substrate Public/Granted day:2008-07-31
Information query
IPC分类:
