Invention Grant
- Patent Title: Laser crystallization method for amorphous semiconductor thin film
- Patent Title (中): 非晶半导体薄膜的激光结晶方法
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Application No.: US12576938Application Date: 2009-10-09
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Publication No.: US07919366B2Publication Date: 2011-04-05
- Inventor: Takahisa Jitsuno , Keiu Tokumura , Ryotaro Togashi , Toshio Inami , Hideaki Kusama , Tatsumi Goto
- Applicant: Takahisa Jitsuno , Keiu Tokumura , Ryotaro Togashi , Toshio Inami , Hideaki Kusama , Tatsumi Goto
- Applicant Address: JP Osaka JP Tokyo
- Assignee: Osaka University,The Japan Steel Works, Ltd.
- Current Assignee: Osaka University,The Japan Steel Works, Ltd.
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JP2008-265612 20081014
- Main IPC: H01L21/268
- IPC: H01L21/268

Abstract:
A laser crystallization method in which an amorphous silicon thin film 2 formed on a substrate 1 is irradiated with a laser beam, the method including the steps of providing the amorphous silicon thin film 2 with an absorbent to form an absorbent layer 3 on the desired specific local areas of the amorphous silicon thin film 2 and laser annealing for crystallizing the specific local areas of the amorphous silicon thin film 2 by irradiating the amorphous silicon thin film 2 including the specific local areas with a semiconductor laser beam L having a specific wavelength absorbable by the absorbent layer 3 and unabsorbable by the amorphous silicon thin film 2 for heating the absorbent layer 3.
Public/Granted literature
- US20100093182A1 LASER CRYSTALLIZATION METHOD FOR AMORPHOUS SEMICONDUCTOR THIN FILM Public/Granted day:2010-04-15
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