Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12211123Application Date: 2008-09-16
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Publication No.: US07919375B2Publication Date: 2011-04-05
- Inventor: Dae-Kyeun Kim
- Applicant: Dae-Kyeun Kim
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Sherr & Vaughn, PLLC
- Priority: KR10-2007-0136172 20071224
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device and a method for manufacturing the device capable of preventing an LDD region and a lower portion of the gate electrode from overlapping each other to achieve desirable device performance are disclosed. Embodiments relate to a semiconductor device and a method for manufacturing the device that may minimize overlap between an LDD region and a lower portion of the gate electrode. Minimizing overlap may maximize device performance and minimize the generation of defects between gate electrodes.
Public/Granted literature
- US20090160010A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE DEVICE Public/Granted day:2009-06-25
Information query
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