Invention Grant
- Patent Title: Method for thinning substrate and method for manufacturing circuit device
- Patent Title (中): 薄板化方法及制造电路器件的方法
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Application No.: US11517157Application Date: 2006-09-07
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Publication No.: US07919394B2Publication Date: 2011-04-05
- Inventor: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- Applicant: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao
- Applicant Address: JP Kanagawa
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Carrier Blackman & Associates, P.C.
- Agent Joseph P. Carrier; William D. Blackman
- Priority: JP2005-260469 20050908
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
A method for thinning a substrate and a method for manufacturing a circuit device which make it possible to prevent the pattern of penetrating holes of a supporting plate from being transferred to the surface of the substrate and prevent non-uniform grinding of the surface of the substrate from occurring. The supporting plate and the substrate are joined by using an adhesive layer, and a sheet is attached to the supporting plate. The surface of the supporting plate to which the sheet has been attached is mounted and fixed by attraction onto an attracting head. The surface of the semiconductor wafer on which no circuit device is formed is ground by a grinder in this state.
Public/Granted literature
- US20070054470A1 Method for thinning substrate and method for manufacturing circuit device Public/Granted day:2007-03-08
Information query
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