Invention Grant
- Patent Title: Semiconductor device manufacturing method and display device
- Patent Title (中): 半导体器件制造方法及显示装置
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Application No.: US12101574Application Date: 2008-04-11
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Publication No.: US07919399B2Publication Date: 2011-04-05
- Inventor: Toshiaki Arai
- Applicant: Toshiaki Arai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2007-111793 20070420
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Disclosed herein is a semiconductor device manufacturing method for performing an annealing process of irradiating a semiconductor film on which element forming areas including thin film transistor forming areas are arranged in a two-dimensional pattern with energy beams using a plurality of irradiating optical systems, wherein in the annealing process, an area irradiated with the energy beams is divided into a single beam irradiated area irradiated by each of the plurality of irradiating optical systems with an energy beam singly and a boundary area situated between single beam irradiated areas adjacent to each other and irradiated by both of two irradiating optical systems performing beam irradiation of the single beam irradiated areas with energy beams.
Public/Granted literature
- US20080258154A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND DISPLAY DEVICE Public/Granted day:2008-10-23
Information query
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