Invention Grant
US07919651B2 Positive resist composition, method of forming resist pattern, polymeric compound, and compound
有权
正型抗蚀剂组合物，形成抗蚀剂图案的方法，聚合物和化合物
- Patent Title: Positive resist composition, method of forming resist pattern, polymeric compound, and compound
- Patent Title (中): 正型抗蚀剂组合物，形成抗蚀剂图案的方法，聚合物和化合物
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Application No.: US12536779Application Date: 2009-08-06
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Publication No.: US07919651B2Publication Date: 2011-04-05
- Inventor: Daiju Shiono , Takahiro Dazai , Hiroaki Shimizu
- Applicant: Daiju Shiono , Takahiro Dazai , Hiroaki Shimizu
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe, Martens, Olson & Bear, LLP
- Priority: JP2007-205500 20070807; JP2008-003339 20080110
- Main IPC: C07C69/73
- IPC: C07C69/73 ; C07C69/66
Abstract:
A compound represented by general formula (I) shown below; and a polymeric compound having a structural unit (a0) represented by general formula (a0-1) shown below: wherein R1 represents a hydrogen atom, a lower alkyl group or a halogenated lower alkyl group; A represents a divalent hydrocarbon group of 2 or more carbon atoms which may have a substituent; B represents a divalent hydrocarbon group of 1 or more carbon atoms which may have a substituent; and R2 represents an acid dissociable, dissolution inhibiting group.
Public/Granted literature
- US20090312573A1 POSITIVE RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND, AND COMPOUND Public/Granted day:2009-12-17
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