Invention Grant
- Patent Title: System and a method for controlling flow of solder
- Patent Title (中): 用于控制焊料流动的系统和方法
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Application No.: US11746260Application Date: 2007-05-09
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Publication No.: US07919714B2Publication Date: 2011-04-05
- Inventor: Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
- Applicant: Arun Virupaksha Gowda , Kevin Matthew Durocher , James Wilson Rose , Paul Jeffrey Gillespie , Richard Alfred Beaupre , David Richard Esler
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Ann M. Agosti
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.
Public/Granted literature
- US20080277456A1 SYSTEM AND A METHOD FOR CONTROLLING FLOW OF SOLDER Public/Granted day:2008-11-13
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