Invention Grant
- Patent Title: Printed wiring board and electronic apparatus
- Patent Title (中): 印刷线路板和电子设备
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Application No.: US12580124Application Date: 2009-10-15
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Publication No.: US07919716B2Publication Date: 2011-04-05
- Inventor: Kiyomi Muro , Gen Fukaya
- Applicant: Kiyomi Muro , Gen Fukaya
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: JP2008-304695 20081128
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01R12/04

Abstract:
According to one embodiment, a printed wiring board includes an insulating layer, a first conductor pattern on the insulating layer configured to be a signal line, and a second conductor pattern on the insulating layer. The second conductor pattern includes a larger conductor area than the first conductor pattern, and a slit which allows the second conductor pattern to stretch to follow a thermal expansion of the insulating layer.
Public/Granted literature
- US20100132981A1 PRINTED WIRING BOARD AND ELECTRONIC APPARATUS Public/Granted day:2010-06-03
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