Invention Grant
- Patent Title: Method of measuring taper angle in wire electric discharge machining apparatus and measuring tool
- Patent Title (中): 线放电加工装置和测量工具中锥角测量方法
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Application No.: US11881310Application Date: 2007-07-25
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Publication No.: US07919721B2Publication Date: 2011-04-05
- Inventor: Yasushi Hayashi
- Applicant: Yasushi Hayashi
- Applicant Address: JP Yokohama, Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Yokohama, Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-204728 20060727
- Main IPC: B23H7/10
- IPC: B23H7/10

Abstract:
A method of measuring a taper angle in a wire electric discharge machining apparatus comprises, the steps of: providing a measuring tool (2) having lower and upper edges (27, 23) being spaced by a given height (H); moving a vertical wire electrode (EV) from a reference position (R) in one direction by a first distance (X1) to the lower edge (27); moving the vertical wire electrode from the reference position in the one direction by a second distance (X2) to the upper edge (23); moving an inclined wire electrode (EI) from the reference position in the one direction by a third distance (X3) to the lower edge; moving the inclined wire electrode from the reference position in the one direction by a fourth distance (X4) to the upper edge; and calculating a taper angle (θ) of the inclined wire electrode based on the following equation: θ=tan−1 γ/H γ=|(X3−X1)−(X4−X2)|.
Public/Granted literature
- US20080047936A1 Method of measuring taper angle in wire electric discharge machining apparatus and measuring tool Public/Granted day:2008-02-28
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