Invention Grant
- Patent Title: Cutting device for cutting hard-brittle material
- Patent Title (中): 用于切割硬脆材料的切割装置
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Application No.: US11862497Application Date: 2007-09-27
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Publication No.: US07919724B2Publication Date: 2011-04-05
- Inventor: Kuo-Cheng Huang , Chien-Yao Huang , Shih-Feng Tseng , Wen-Hong Wu
- Applicant: Kuo-Cheng Huang , Chien-Yao Huang , Shih-Feng Tseng , Wen-Hong Wu
- Applicant Address: TW Taipei
- Assignee: National Applied Research Laboratories
- Current Assignee: National Applied Research Laboratories
- Current Assignee Address: TW Taipei
- Agency: Volpe and Koenig, P.C.
- Priority: TW96128090A 20070731
- Main IPC: B23K26/14
- IPC: B23K26/14 ; B23K26/00

Abstract:
A cutting device for cutting a hard-brittle material along a cutting path is provided. The cutting device includes a cooling source having a first output terminal for providing a first cooling effect along the cutting path, and a heating source having a second output terminal disposed in the first output terminal for providing a heating effect following the first cooling effect along the cutting path.
Public/Granted literature
- US20090032505A1 CUTTING DEVICE FOR CUTTING HARD-BRITTLE MATERIAL Public/Granted day:2009-02-05
Information query
IPC分类: