Invention Grant
- Patent Title: Laser processing apparatus and laser processing method
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US11557332Application Date: 2006-11-07
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Publication No.: US07919727B2Publication Date: 2011-04-05
- Inventor: Akira Nishiya , Norihisa Koga , Naoto Yoshitaka
- Applicant: Akira Nishiya , Norihisa Koga , Naoto Yoshitaka
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-345723 20051130
- Main IPC: B23K26/00
- IPC: B23K26/00

Abstract:
A laser processing apparatus includes: a laser beam radiation part that radiates a laser beam to a target position on a substrate; a liquid supply source; a liquid supply nozzle that is connected to the liquid supply source through a liquid supply channel; a guide member for the ejected liquid; and a movement mechanism that allows a substrate holding part, and the laser beam radiation part, the guide member and the liquid supply nozzle to relatively move in a horizontal direction in a state that a center of a radiation spot of the laser beam is in a projection region on the substrate when the liquid ejection port of the liquid supply nozzle is extended in an ejection direction.
Public/Granted literature
- US20070119837A1 LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD Public/Granted day:2007-05-31
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