Invention Grant
- Patent Title: Heating device
- Patent Title (中): 加热装置
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Application No.: US11577635Application Date: 2005-07-27
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Publication No.: US07919736B2Publication Date: 2011-04-05
- Inventor: Toshihisa Ikeda , Kiyoshi Kanazawa
- Applicant: Toshihisa Ikeda , Kiyoshi Kanazawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: RatnerPrestia
- Priority: JP2004-318978 20041102; JP2004-318979 20041102; JP2004-359427 20041213
- International Application: PCT/JP2005/013727 WO 20050727
- International Announcement: WO2006/048964 WO 20060511
- Main IPC: H05B6/50
- IPC: H05B6/50 ; H05B6/66

Abstract:
A heating device includes a main body with an opening, a magnetron for generating electromagnetic waves for heating, a door for putting in and taking out an object to be heated, a reader, and a barrier. The magnetron emits electromagnetic waves into the main body. The door covers the opening of the main body. The reader reads information contained in a wireless IC tag attached to the object to be heated. The barrier acts a shield for the reader from the electromagnetic waves emitted by the magnetron when the door is closed, and the shield is broken when the door is opened.
Public/Granted literature
- US20080105673A1 Heating Device Public/Granted day:2008-05-08
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